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SEOUL—South Korea’s SK hynix, the world’s second-largest memory chipmaker, said Friday it will collaborate with Taiwanese semiconductor giant TSMC to make next-generation high-bandwidth memory chips used in AI technology.
The South Korean company “recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM”, SK hynix said in a statement on Friday. To develop HBM4, TSMC’s “advanced logic process” will be adopted to produce “customized HBM that meets a wide range of customer demand for performance and power efficiency”, SK hynix said.The two firms will also collaborate to optimize the integration of SK hynix’s HBM and TSMC’s packaging process, called CoWoS technology, the South Korean company said.
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