The new jobs will include at least 200 engineers and technicians, while the rest will be operators and facility managers.
SINGAPORE – Japanese manufacturer Toppan Holdings broke ground for a semiconductor packaging materials plant in Singapore on March 14 that will begin operations at the end of 2026 and create as many as 350 new jobs.
Toppan did not disclose the capital investment in the plant, but Japanese newspaper Nikkei reported that the figure is estimated at 50 billion yen . Nikkei also said that the factory’s capacity will increase in line with demand, with total investment expected to surpass 100 billion yen. Mr Tetsuro Ueki, senior managing executive officer and head of Toppan’s electronics division, told the groundbreaking ceremony on March 14 that the company chose Singapore as it looked for venues outside Japan to boost the production of what are known as Flip Chip Ball Grid Array substrates.
He added that the plant, which will be run by a new Toppan subsidiary called Advanced Substrate Technologies , will be more advanced than its similar facility in Niigata, Japan, as it will use state-of-the-art automation technology. Dr Kawwas noted that Broadcom has many partners that make other chip components – such as foundries that manufacture integrated circuits, and companies that test and assemble the chip – in Singapore.
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